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Persona de Contactar Ahora : Roger
Número de teléfono : 18918164653
whatsapp : +8618918164653

Double cladding 2D fiber arrays Circle ring type PM Fiber

Place of Origin CHINA
Nombre de la marca YOGEL
Certificación ISO9000
Minimum Order Quantity 1
Precio negotiate
Packaging Details Carton box
Payment Terms L/C, D/A, T/T, Western Union, MoneyGram
Supply Ability 100 pieces per month

Éntreme en contacto con gratis las muestras y los vales.

whatsapp:0086 18588475571

Wechat: 0086 18588475571

Skype: sales10@aixton.com

Si usted tiene alguna preocupación, proporcionamos ayuda en línea de 24 horas.

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Descripción de producto
Double cladding 2D fiber arrays Circle ring type PM Fiber
 
 
Due to the use of high-end chip manufacturing technology, our company's fiber array products are not limited by the thickness and arrangement shape of the fiber. The thinnest fiber can reach 25um. The arrangement shape can be the traditional straight line; it can also be square, circular; it can even be parabolic, M-shaped, and random. The products cover one-dimensional linear arrays, two-dimensional surface arrays, and three-dimensional spherical fiber arrays.
 

The products can be used under harsh conditions such as high pressure, high vacuum, high temperature, and ultra-low temperature. They have good environmental adaptability and are widely used in communications, measurement, imaging, printing, welding and other fields.

 

Feature:

  • Fiber type (specify size, material): 40/48/55, quartz
  • NA:0.22
  • Single fiber attenuation:≦1 dB/m
  • Number of fibers:271
  • Device length: 3m (split beam length 0.5m)
  • Arrangement: Hexagonal Dense Pile Array
  • Duty Cycle:52%
  • Split strategy:1:7
  • Closed End Connector: Standard SMA905
  • Split-end connector.:Standard SMA905
  • Closed end face size: hexagonal with side length 0.459mm
  • Split bundle end face dimensions: 6 pcs φ0.385; 1pcs φ0.05
  • Channel Yield:≥99%
  • Yield rate of channels within 4 circles of the center: 100%

     Application:

     *Silicon photonics field

     *PIC coupling application

     *Grating coupling applications

     *High-efficiency coupling of small mode spot laser chips

     *Non-dimmable high-efficiency coupling

     *Resistant to reflow soldering applications

     *High power applications

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